On the Nokia phone I just looked at is another bare die flip mounted direct to the board. Its the Cambridge Silicon Radio (CSR) 41B14 a dedicated Bluetooth transceiver.
Getting it off the board I chipped the die quite badly trying to lever it off the board before the solder balls had fully melted. The die measures 3.7 x 3.9 mmMost of the die is digital, it is too fine for an optical microscope, I estimate this is made on a 180nm process and has about 6 layers of metal. Dedicated Bluetooth chips are pretty obsolete today, the functionality is integrated with other functions such as the Wi-Fi transceiver. The digital area on this chip is just under 9 mm2 each process node the linear dimensions are shrunk ~70% and the area required for logic is halved. If this chip was fabbed on 28 nm (Which is still 2 or 3 nodes older than state of the art today, but is still a popular node for mixed digital/analog) the whole digital block would be less than 0.3 mm2 (Hence why its integrated with other functions today) that’s the power of Moore’s law and the fantastic technical progress that the semiconductor industry has continually achieved for the past 50 years.
The code name for this die?
Look around the die what can you find Bond’s Oddjob!This is an impressive piece of Silicon art. Two layers of copper have been used, in combination to get the mottled effect on the hat, or individually to bring out the facial features.
Not sure what this is (A happy dragon?). Somebody at CSR had too much time on their hands. It always amazes me, miniature art that very few people will ever see.